Meeting the Challenges of High-Power, Compact Technology: Thermal Management and Sealing Solutions for Next-Generation Electronics

Thermal challenges in next-gen electronics are becoming more prominent as new products like 5G Wi-Fi, electrified vehicles, advanced robotics, cryptocurrency, and AI-integrated devices demand increasing amounts of power. With these cutting-edge technologies often relying on and integrating with one another, it is essential that each device operates flawlessly.

Market drivers for thermal materials include higher power, faster speeds, compact designs, limited airflow, extended product life expectancy, and stringent reliability requirements.

Along with the request for higher-powered devices, engineers are also faced with requirements for:

- - Higher computing speeds.
  - Smaller form factors.
  - Increased product life expectancy.
  - More reliable and robust products.

This need for larger amounts of energy in a smaller form factor can present issues such as:

- - An overworked energy grid.
  - Extreme amounts of generated heat from components.
  - Increased pressure on seals in enclosures due to generated heat.
  - High-frequency signal escape from devices.
  - Decreased efficiency or device failure due to any of the above factors.

Market trends in thermal materials are evolving rapidly to address these challenges. Thermal requirements are focusing on higher thermal conductivity and lower thermal impedance, ensuring that devices operate efficiently under intense conditions. Physically, there is a growing need for materials that offer greater compliance, conformability, adhesion, and reduced weight, all of which contribute to improved performance and ease of integration into smaller, high-powered devices. Regulatory needs are also becoming more stringent, with a focus on long service life, higher reliability, lower warranty costs, and ease of handling and application.

As we move into the next generation of electronics, Sealing Devices, along with our suppliers, are committed to providing products that meet or exceed our customers’ rigorous requirements. We offer a variety of off-the-shelf and custom solutions that can provide customers with heat dissipation, pressure relief and venting, EMI shielding, and much more. We are excited to help our customers meet their demands and push the boundaries in new emerging markets. Take a look at some new product offerings from Parker Chomerics.

Thermal Gels: Addressing Thermal Issues in Advanced Electronics

Dispensable, one component, fully cured gels that can conform to irregular surfaces. These thermal gels require minimal compression force and are a great option for high volume assembly applications. Available in silicone and non-silicone formulations with thermal conductivities ranging from <1 to 7.5 W/m-K.

NEW! THERM-A-GAP GEL 35VT – Reworkable, high-tack gel designed for vibration and vertical installation. Typical thermal conductivity: 3.5 W/m-K

NEW! THERM-A-GAP GEL 50VT – Reworkable, high-tack gel designed for vibration and vertical installation. Typical thermal conductivity: 5.2 W/m-K

Thermal Gap Pads: Heat Management in New Electronic Technologies

Sheet material that can be cut into custom shapes and designs. These products are easily installed by hand and provide high levels of thermal conductivity to address thermal challenges in next-gen electronics. Thermal gap pads can help fill voids and conform to irregular heat sink surfaces. They come in a variety of configurations and can also be provided with a thermally conductive pressure sensitive adhesive.

NEW! THERMAL GAP PAD 30 – Soft, low-cost conformable pad. Typical thermal conductivity: 3.2 W/m-K

NEW! THERMAL GAP PAD 60 – High performing pad with low compression force. Typical thermal conductivity: 6.0 W/m-K

NEW! THERMAL GAP PAD 70TP – Very soft (15 shore 00) and high performing pad. Typical thermal conductivity: 7.0 W/m-K

NEW! THERMAL GAP PAD 80 – Highest performing gap pad in the family with a very thin (0.020”) construction. Typical thermal conductivity: 8.2 W/m-K

Thermal Potting Compounds: Heat Dissipation in Cutting-Edge Electronic Devices

Two-Part dispensable materials that can encapsulate and protect high power electronics. These compounds offer a very robust and reliable solution, while maintaining a high thermal conductivity to draw heat away from the hot components they encapsulate. Thermal potting compounds are a great thermal solution for products that will be subjected to shock and vibration and other physical stresses. They are easy to dispense, and certain compounds meet ASTM E595 for outgassing.