Thermal Management Solutions
Premier Thermal Management Solutions
Sealing Devices is an industry-leading distributor of premium thermal interface materials for any thermal management application. Thermal interface materials transfer heat from electronic components to heat sinks and are used to eliminate air gaps from the interface. The materials we offer have been designed for thousands of thermal management applications, ensuring high performance and integrity.
Our Trusted Suppliers
We partner with top suppliers like Parker Chomerics to provide premium thermal interface materials to various industries ensuring high performance and integrity for thousands of applications.
Industry-leading materials deliver:
Lower thermal impedance – Our thermal management products ensure effective thermal performance in power electronics applications by reducing thermal impedance.
Higher thermal conductivity – Due to their high thermal conductivity, these solutions achieve efficient heat dissipation in telecommunications equipment applications.
Greater compliance and conformability – Thermal management materials are commonly used in consumer electronics and heat sink applications because they can accommodate and conform to various surface types while maintaining compliance with governmental regulations.
Highly reliable – Due to their consistent performance and durability, our selection of thermal management products is used in a wide variety of consumer electronics, heat sinks, and vibration-dampening applications.
Greater adhesion properties – These materials offer long-lasting and reliable adhesion capabilities in applications such as telecommunications infrastructure components and heat sink mounting.
What is a Thermal Management System?
A thermal management system in electronic packaging is designed to efficiently remove heat from the semiconductor junction to the surrounding environment. Effective thermal management is crucial to maintaining the performance and longevity of electronic components.
Heat Transfer Fundamentals
This process can be divided into three major phases:
- Heat transfer within the semiconductor component package
- Heat transfer from the package to a heat dissipater (initial heat sink)
- Heat transfer from the heat dissipater to the ambient environment (ultimate heat sink)
The first phase is generally beyond the control of the system-level thermal engineer because the package type defines the internal heat transfer processes. In the second and third phases, the packaging engineer’s goal is to design an efficient thermal connection from the package surface to the initial heat spreader and onto the ambient environment.
Achieving optimal thermal management in these phases requires a thorough understanding of heat transfer fundamentals as well as knowledge of available interface materials and how their key physical properties affect the heat transfer process. Sealing Devices’ application engineers are onsite and available to answer any thermal management questions or assist in funding the right solution for you.
Thermal Management Products
Thermally Conductive Pads & Fillers
Parker Chomerics THERM-A-GAP™ gap filler pads are for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
Thermally Conductive Gels
Parker Chomerics THERM-A-GAP™ GEL are a single component dispensable thermal gap fillers that require no curing and can be dispensed over a heat-generating component for effective cooling.
Thermally Conductive Tapes
Parker Chomerics THERMATTACH® tapes are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism
Why Choose Sealing Devices For Thermal Management Systems?
Industry Expertise: With decades of experience in thermal management, Sealing Devices offers unparalleled knowledge and expertise in providing effective thermal solutions for various industries.
Premium Materials: We distribute high-performance thermal interface materials that are engineered to efficiently transfer heat from electronic components to heat sinks, eliminating air gaps and ensuring superior thermal conductivity and reliability.
Tailored Solutions: We offer customized thermal management solutions tailored to the specific requirements of diverse industries. Our team works closely with you to understand your challenges and deliver the most effective solutions for each application.
Innovation and Compliance: We stay ahead of industry trends and regulatory requirements, as demonstrated by our ISO 9001:2015 and AS9100D certifications. Our materials provide excellent thermal performance while complying with governmental regulations, ensuring safety and efficiency in all applications.
Your Industry-Leading Thermal Management Supplier
Sealing Devices brings decades of expertise to manufacturing and distributing high-performing and reliable thermal management materials trusted across various industries including aerospace, industrial, electronics, and more. Whether you require lower thermal impedance, better heat sink adhesion, or more reliable thermal management, our team of experts will work with you to find the optimal thermal management solution for your applications.